- Preparation method of new aluminum-based silicon carbide material (AISIC) and application prospect of new SICP material
- What is IGBT
- Innovative electronic semiconductor solutions for semiconductor packaging
- Silicon carbide particle reinforced aluminum matrix composites
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With the continuous breakthroughs in the aerospace industry in recent years, the successful launch of many manned space projects is inseparable from the support of many new materials. Among them, th
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2021-11-23What is IGBT
IGBT (insulated gate bipolar transistor) is a composite fully controlled voltage driven power semiconductor device composed of BJT (bipolar triode) and MOS (insulated gate field effect transistor). It
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Today's consumers want smaller devices, more functions, excellent reliability and, of course, lower costs. In semiconductor packaging, all this can be achieved through Henkel's material soluti
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It is a particle reinforced metal matrix composite, which uses Al alloy as the matrix, according to the design requirements, in a certain form, proportion and distribution state, and SiC particles as
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