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◆ simple appearance and structure, but with super heat dissipation capacity,

◆ it has thermal expansion coefficient matching with different substrates and high thermal conductivity

◆ excellent high temperature stability and uniformity

◆ basic use

◇ heat dissipation of electronic chip (special integrated circuit) and power module

◇ application in military and Aerospace Engineering

◇ heat dissipation of high-power LED

◆ nickel plating, gold, silver, etc